| Application Area | Avg. Connection Failure Rate (%) | Market Growth Rate (2023-2028) | Key Features |
|---|---|---|---|
| Consumer Electronics | 1.5 | 8% | Compact Design, High Durability |
| Automotive | 0.5 | 10% | Temperature Resistant, Vibration Proof |
| Industrial Automation | 2 | 7% | Robustness, Easy Installation |
| Medical Devices | 0.3 | 9% | Biocompatible Materials, High Reliability |
| Telecommunications | 1 | 6% | Signal Integrity, Long Lifespan |
| Aerospace | 0.2 | 12% | Lightweight, High Performance |