| Application Area | Market Share (%) | Growth Rate (2023-2025) | Key Features |
|---|---|---|---|
| Automotive | 35 | 8% | High temperature resistance, EMI shielding |
| Telecommunications | 30 | 10% | High-speed data transfer, durability |
| Consumer Electronics | 25 | 7% | Compact design, low power consumption |
| Industrial Automation | 10 | 12% | Robustness, environmental resistance |